SK Hynix is set to receive an initial $450 million in U.S. grants and $500 million in loans to build an advanced chip packaging and research facility in Indiana.
and News
and News
SK Hynix is set to receive an initial $450 million in U.S. grants and $500 million in loans to build an advanced chip packaging and research facility in Indiana.
2 min read
2 min read
1 min read
2 min read